LEGO's new SMART brick, released in early 2026, packs sensors, RGB LEDs, a speaker, microphone, NFC, Bluetooth 5.4 (EM9305 SoC), 16 Mb SPI Flash, and a custom ASIC (DA000001-04) into a 2×4 stud form factor. A teardown reveals the brick is inductively charged and extremely well-sealed, requiring destructive disassembly. The custom ASIC appears to be a flip-chip package with CSEM markings, hinting at its design origins but leaving its internals a mystery. The lack of external RAM suggests the ASIC contains onboard RAM. The sealed, non-repairable design with a built-in Li-ion battery raises right-to-repair and EU battery regulation concerns.

3m read timeFrom hackaday.com
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