Semron has raised $7.9 million (7.3 million euros) for AI chips with 3D packaging for mobile devices.

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Semron has raised $7.9 million for AI chips with 3D packaging for mobile devices. The funding will support semiconductor innovation and the development of advanced computer chips designed for small consumer devices. Semron's proprietary CapRAM technology promises a 20-fold increase in chip efficiency and energy efficiency. The company plans to intensify hardware and compiler development, expand the team, and focus on internationalization.

Semron raises $7.9M for AI chips with 3D packaging