Part 4 of a DIY FPGA board series documents the design and assembly of a next-generation board featuring the Efinix Ti60F256 FPGA and 1GB DDR3L memory in BGA packages. The author details the challenges of 6-layer PCB design, trace length matching for DDR3, and hand-soldering BGA chips using a bottom heater and solder paste

9m read timeFrom blog.mikhe.ch
Post cover image
Table of contents
Time to design a new boardHow to solder BGASystem on ChipResults

Sort: