Glass substrates are emerging as a promising replacement for organic substrates in advanced chip packaging. Companies like Absolics (a Georgia Tech spinout backed by $175M in CHIPS Act funding) and Intel are moving toward commercial production of glass-based chip packages. Glass offers 10x denser connections per millimeter, 50% more silicon per package area, better thermal stability to reduce warpage, and potential for light-based signal pathways that could dramatically cut energy use. Absolics is beginning commercial manufacturing in 2026 at its Covington, Georgia facility, while Samsung, LG Innotek, and others are accelerating their own glass substrate programs. IDTechEx projects the glass semiconductor substrate market could grow from $1B in 2025 to $4.4B by 2036.
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