2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics

The 2024 IEEE Electronic Components and Technology Conference (ECTC) will feature cutting-edge microelectronics packaging technologies, including topics such as heterogeneous integration, photonics, components, materials, assembly, and more. The conference will take place on May 28-31, 2024 in Denver, Colorado.